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1. Temperature: As the temperature rises, the chemical reaction ability of the polishing liquid is enhanced, and the polishing rate increases. However, too high a temperature will cause the polishing liquid to volatilize, accelerate the chemical reaction, and cause serious surface corrosion, which will produce an uneven polishing effect and reduce the polishing quality.
2. pH value: The higher the pH value of the polishing liquid, the stronger the alkalinity and the faster the reaction rate. However, the pH value has a great influence on the etching of the polished surface, the decomposition and solubility of the abrasive, and the stability of the polishing liquid, thereby affecting the material removal rate and surface quality, so it should be strictly controlled.
3. Pressure: Generally, the greater the pressure, the faster the polishing rate. However, when the pressure is large enough, the polishing rate will decrease slightly because the pressure is high and the polishing pad's ability to carry the polishing liquid decreases. In addition, high pressure is prone to fragmentation.
4. Rotation speed: As the rotation speed increases, the polishing rate increases. However, too high a rotation speed will cause the polishing liquid to be unevenly distributed on the polishing pad, affecting the polishing quality.
5. Polishing fluid concentration: When the concentration of the polishing fluid increases, the removal rate also increases. However, when the abrasive concentration exceeds a certain value, the material removal rate will stop increasing and maintain a constant value. This phenomenon is called removal saturation. Moreover, too high a concentration may cause an increase in surface defects (scratches) and affect the surface quality.